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  CSD16321Q5 n-channel ciclon nexfet ? power mosfets ? 2008 ciclon semiconductor device corp., rev 2.0 www.ciclonsemi.com all rights reserved. confidential and prop rietary information. do not distribute. type package package media qty ship CSD16321Q5 qfn 5x6 plastic package 13 inch reel 2500 tape and reel v ds 25 v q g 14 nc q g d 2.5 nc r ds(on) v gs = 3.0v 2.8 m ? v gs = 4.5v 2.1 m ? v gs = 8.0v 1.9 m ? v th 1.1 v maximum values ( t a = 25 o c unless otherwise stated) symbol parameter value units v ds drain to source voltage 25 v v gs gate to source voltage +10 / -6 v i d continuous drain current, t c = 25c 100 a continuous drain current 1 31 a i dm pulsed drain current, t a = 25c 2 200 a p d power dissipation 1 3.1 w t j , t stg operating junction and storage temperature range -55 to 150 c e as avalanche energy, single pulse i d =66a, l = 0.1mh, r g = 25 218 mj 1. r ja = 39 0 c/w on 1in 2 cu (2 oz.) on 0.060 thick fr4 pcb. 2. see figure 10 features ? optimized for 5v gate drive ? ultra low qg & qgd ? low thermal resistance ? avalanche rated ? pb free terminal plating ? rohs compliant qfn 5mm x 6mm plastic package ordering information top view s s g d d d d s 5 6 7 8 4 3 2 1 g s s s d d d d d 5 6 7 8 4 3 2 1 g s s s d d d d d product summary r ds ( on ) vs. v gs gate charge 0 1 2 3 4 5 6 012345678910 v gs - gate to source voltage (v) r ds(on) - on resistance (m ? ) i d = 25a t c = 125oc t c = 25o c 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 35 qg - gate charge (nc) gate voltage (v) v ds = 12.5v i d = 25a
CSD16321Q5 n-channel ciclon nexfet ? power mosfets ? 2008 ciclon semiconductor device corp., rev 2.0 www.ciclonsemi.com all rights reserved. confidential and prop rietary information. do not distribute. symbol parameter test conditions min typ max units static characteristics bv dss drain to source voltage v gs = 0v, i d = 250a 25 ? ? v i dss drain to source leakage current v gs = 0v, v ds = 20v ? ? 1 a i gss gate to source leakage current v ds = 0v, v gs = 10v ? ? 100 na v gs(th) gate to source threshold voltage v ds = v gs, i d = 250a 0.9 1.1 1.4 v r ds(on) drain to source on resistance v gs = 3.0v, i d = 25a ? 2.8 3.5 m ?? v gs = 4.5v, i d = 25a ? 2.1 2.6 m ? v gs = 8.0v, i d = 25a ? 1.9 2.4 m ? g fs transconductance v ds = 12.5v , i d = 25a ? 150 ? s dynamic characteristics c iss input capacitance v gs = 0v, v ds = 12.5v f = 1mhz ? 2360 3100 pf c oss output capacitance ? 1700 2200 pf c rss reverse transfer capacitance ? 115 150 pf r g series gate resistance ? 1.2 ? ? q g gate charge total (4.5v) v ds = 12.5v, i d = 25a ? 14 19 nc q gd gate charge gate to drain ? 2.5 ? nc q gs gate charge gate to source ? 4.0 ? nc q g(th) gate charge at vth ? 2.1 ? nc q oss output charge v ds = 15v, v gs = 0v ? 36 ? nc t d(on) turn on delay time v ds = 12.5v v gs = 4.5v i d = 25a r g = 2.7 ?? ? 11 ? ns t r rise time ? 19 ? ns t d(off) turn off delay time ? 40 ? ns t f fall time ? 30 ? ns diode characteristics v sd diode forward voltage i s = 25a, v gs = 0v ? 0.8 1.0 v q rr reverse recovery charge v dd =13v, i f = 25a, di/dt = 300a/s ? 33 ? nc t rr reverse recovery time v dd =13v, i f = 25a, di/dt = 300a/s ? 32 ? ns electrical characteristics (t a = 25 o c unless otherwise stated)
CSD16321Q5 n-channel ciclon nexfet ? power mosfets ? 2008 ciclon semiconductor device corp., rev 2.0 www.ciclonsemi.com all rights reserved. confidential and prop rietary information. do not distribute. symbol parameter min typ max units thermal characteristics r jc thermal resistance junction to case 3 ? ? 1.1 c/w r ja thermal resistance junction to ambient 3,4 ? ? 50 c/w 3. r jc is determined with the device mounted on a 1in square 2 oz. cu pad on a 1.5x1.5 in .060in thick fr4 board. r jc is guaranteed by design while r ca is determined by the user?s board design. 4. device mounted on fr4 material with 1in 2 of 2 oz. cu. 0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10 100 1000 puls e duration (s ) zth ja normalized thermal impedance duty cycle =t 1 /t 2 rth ja = 39 0 c/w (max cu) t j = p * zth ja * rth ja t 1 t 2 p 0.02 0.1 0.05 0.3 0.01 0.5 single pulse figure 1: transient thermal impedance thermal characteristics (t a = 25 o c unless otherwise stated) max r ja = 48 o c/w when mounted on 1in 2 of 2 oz. cu. max r ja = 115 o c/w when mounted on min pad area of 2 oz. cu.
CSD16321Q5 n-channel ciclon nexfet ? power mosfets ? 2008 ciclon semiconductor device corp., rev 2.0 www.ciclonsemi.com all rights reserved. confidential and prop rietary information. do not distribute. 0 10 20 30 40 50 60 70 80 00.511.522.53 v ds - drain to source voltage (v) drain current (a) v gs = 4.5v v gs = 3.0v v gs = 2.5v v gs = 2.0v v gs = 1.5v figure 2: saturation characteristics figure 3: transfer charact eristics 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 35 qg - gate charge (nc) gate voltage (v) v ds = 12.5v i d = 25a 0 1 2 3 4 5 6 0 5 10 15 20 25 v ds - drain to source voltage (v) capacitance (nf) v gs = 0v , f = 1mhz c iss = c gd +c gs c oss =c ds +c gd c rss = c gd figure 4: gate charge figure 5: capacitance 0 0.2 0.4 0.6 0.8 1 1.2 1.4 -75 -25 25 75 125 175 t c - case temperature (c) v gs (th) - threshold voltage (v) i d = 250 a 0 1 2 3 4 5 6 012345678910 v gs - gate to source voltage (v) r ds(on) - on resistance (m ? ) i d = 25a t c = 125oc t c = 25o c figure 6: threshold voltage vs. temperature figure 7: on resist ance vs. gate voltage typical mosfet characteristics (t a = 25 o c unless otherwise stated) 0 10 20 30 40 50 60 70 80 1 1.25 1.5 1.75 2 2.25 2.5 v gs - gate to source voltage (v) drain current (a) t c = -55o c t c = 25oc t c = 125oc v ds = 5v
CSD16321Q5 n-channel ciclon nexfet ? power mosfets ? 2008 ciclon semiconductor device corp., rev 2.0 www.ciclonsemi.com all rights reserved. confidential and prop rietary information. do not distribute. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 -75 -25 25 75 125 175 t c - case temperature (c) normalized on resistance i d = 25a v gs = 4.5v 0.0001 0.001 0.01 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 v sd - source to drain voltage (v) i sd - source to drain current (a) t c = 125o c t c = 25o c figure 8: on resistance vs. temperature figure 9: typical diode forward voltage 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 v ds - drain voltage (v) i d - drain current (a) 10ms 100ms 1s 1ms dc single pulse r thja =39 0 c/w ( max cu) a rea limited by r ds(on) 1 10 100 1000 1.0e-05 1.0e-04 1.0e-03 1.0e-02 1.0e-01 t av - tim e in avalanche (s) i (av) - peak avalanche current (a) t c = 25o c t c = 125oc figure 10: maximum safe operating area figure 11: single pulse unclamped inductive switching figure 12: maximum drain current vs. temperature typical mosfet characteristics (t a = 25 o c unless otherwise stated) 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 150 175 t c - case temperature ( o c) i d - drain current (a)
CSD16321Q5 n-channel ciclon nexfet ? power mosfets ? 2008 ciclon semiconductor device corp., rev 2.0 www.ciclonsemi.com all rights reserved. confidential and prop rietary information. do not distribute. q5 package dimensions dim millimeters inches min max min max a 0.950 1.050 0.037 0.039 b 0.360 0.460 0.014 0.018 c 0.150 0.250 0.006 0.010 c1 0.150 0.250 0.006 0.010 d1 4.900 5.100 0.193 0.201 d2 4.320 4.520 0.170 0.178 e 4.900 5.100 0.193 0.201 e1 5.900 6.100 0.232 0.240 e2 3.920 4.12 0.154 0.162 e 1.27 typ 0.050 l 0.510 0.710 0.020 0.028 0.00 - - - k 0.760 - 0.030 - f1 6.205 6.305 0.244 0.248 f2 4.460 4.560 0.176 0.180 f3 4.460 4.560 0.176 0.180 f4 0.650 0.700 0.026 0.028 f5 0.620 0.670 0.024 0.026 f6 0.630 0.680 0.025 0.027 f7 0.700 0.800 0.028 0.031 f8 0.650 0.700 0.026 0.028 f9 0.620 0.670 0.024 0.026 f10 4.900 5.000 0.193 0.197 f11 4.460 4.560 0.176 0.180
CSD16321Q5 n-channel ciclon nexfet ? power mosfets ? 2008 ciclon semiconductor device corp., rev 2.0 www.ciclonsemi.com all rights reserved. confidential and prop rietary information. do not distribute. q5 tape and reel information note: 1. 10 sprocket hole pitch cumulative tolerance +/-0.2 2. camber not to exceed 1mm in 100mm, noncumulative over 250mm 3. material:black static dissipative polystyrene 4. all dimensions are in mm (unless otherwise specified) 5. thickness: 0.30 +/-0.05mm package marking information 3rd line lllll= last 5 di g its of the wafer lot # 2nd line (date code) yy = last 2 digits of the year ww = 2-digit work week c = country of origin > philippines = p > taiwan = t > china = c location: 1st line csd = fixed characters nnnnn = product code pin 1 identifier csdnnnnn yywwc lllll 8 5 1 4 5 8 1 4
CSD16321Q5 n-channel ciclon nexfet ? power mosfets ? 2008 ciclon semiconductor device corp., rev 2.0 www.ciclonsemi.com all rights reserved. confidential and prop rietary information. do not distribute. disclaimer ciclon semiconductor device corp. (? ciclon ?) reserves the right to make corrections, m odifications, enhancements, improvements and other changes to its products and services at any time and to discontinue any product or serv ice without notice. customers should ob tain the latest relevant information before placing orders and should verify that such info rmation is current and complete. all products are sold subje ct to ciclon ?s terms and conditions of sale supplied at t he time of order acknowledgement. additional information for further information on technology, delivery terms and conditions, or pricing pl ease contact your nearest ciclon semiconductor representative. ciclon semiconductor device corp. 116 research drive, bethlehem, pa 18015 t 610-849-5100 f 610-849-5101
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dlp? 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